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Allround Trading co., Ltd. PRODUCTS

ASAP

光罩对准曝光机.光刻机 Auto Mask Aligner

Water size:6";Wave length:g,h,l-line;Alignment(exposure)stage:6 Axes
Alignment Accuracy:Topside < ±1um Backsize < ±2um;Mast Stage:Max.7"
Exposure mode:■ Proximity mode ■ Soft contact mode
Exposure mode:■ Hard contact mode ■ Vacuum contact mode
非接触式平行和间隙控制系统
中心定位传输机构、自动校准
精巧设计、机台占地面积小、高性价比、低运行成本

撕金机 Metal Liftoff

Water size:2"~8";
Application:LD, SAW filter, MEMS, Power IC (HEMT), High Frequency (T-Gate)
Substrate:Silicon, GaAN, SIC, GAN, LiTaO3, LiNBO3
Function:Soaking, Special Chuck, Back-side Rinse, Metal collection, Heater, Recycle system
高压、撕金机搭载了ASAP特殊设计喷嘴
单片wafer操作, 避免金属屑再沾黏至下片wafer
厚膜金属、或光刻胶、或微小电路均适用
适合干法刻蚀后的抗蚀物剥离设备
工艺不需要膨胀, 能在短时间内处理 金属无毛刺
涂布机.匀胶机 SPIN COATER

Wafer size 2" ~ 8"
LD, SAW filter or Crystal filter/oscillator/resonator,Power IC (HEMT),Package ceramic
Uniformity:1. Tokyo Ohka TCIR 96cp 8" wafer / measure 25 points (exclude 3mm from edge) Max. 39746A, Min. 39905A Uniformity (Max-Min / Ave): 1.39% Uniformity (WtoW 25pcs): 0.84%
2. AZ electronics AZ4620 400cp 8" wafer / measure 25 points(exclude 3mm from edge)Max. 63013A, Min. 61966A Uniformity (Max-Min / Ave): 1.67% Uniformity (WtoW 25pcs): 0.91%
3. JSR THB 1750cp 8" wafer / measure 25 points(exclude 5mm from edge)Max. 420439A, Min. 404868A Uniformity (Max-Min / Ave): 3.76% Uniformity (WtoW 25pcs): 1.13%
自动涂布光刻胶适用低黏稠度~高黏稠度,专利匀胶设计,方形基板角落 / 圆形 wafer edge边缘云胶厚度,接近中心云胶厚度
10000cp以上高粘稠度,超过400度以上高温烘烤等,均可提出对应设备符合基板尺寸的小型框体
显影机 SPIN DEVELOPER

Wafer size:2"~8"
LD, SAW filter or Crystal filter/oscillator/resonator,Power IC (HEMT),Package ceramic
抗蚀物、聚酰亚胺,全自动显像 / 烘烤
符合基板尺寸的小型框体
无虚换层也能处理不同尺寸的晶圆
对应200μm以上翘曲的搬运系统,能对应各种可减少CoO
传送双手臂、干湿不共享、缩短wafer等待时间、wafer 干进干出
SCREEN,VEECO,SSEC
LIFT OFF,IGBT,VCSEL,PD
撕金機,POWER IC,功率半導體,SAW filter,LD,光電二級體
MEMS,3D感測,Fan-out wafer-level,packageing,FO-WLP
PA,GaN,GaAS,SIC,微波通訊晶片

SPIN,COATER,HEMT,High uniformity,square substrate
全自動 6" 8" 云膠機,高黏稠度,云胶厚度均勻,方形基板
全自動 6" 8" 塗膠機,TOK SUSS,ELS,億力鑫

MASK ALIGNER,Proximity exposure,接近式曝光,Soft contact exposure,軟接觸曝光
半自動光刻機,SUSS,MYCRO,N&Q,Hard contact exposure,硬接觸曝光
掩模對準曝光機

NON CONTACT MEASUREMENT THICKNESS,非接觸厚度量測,德國 ISIS,SENTRONICS,SEMDEX,FSM
光學測量系統,Optical Semiconductor
BOW,Warp,Bump height,TSV via depth,Coating thickness,Film thickness

NON CONTACT MEASUREMENT ROUGHNESS
光學測量系統,Optical Semiconductor
Roll Off,Edge Chip Detection,wafer nanotography
PFA,結晶皿,硅片 wafer,防腐蝕,特氟龍,鐵氟龍,PFA,蝕刻 etching,entegris,結晶皿,crystalizing dish 吊籃,硅片,wafer,蝕刻 etching,entegris,碎片,吊籃,半導體花籃,Dipper Basket PFA 立式花籃,,圓形立式花籃,半導體花籃 PFA cassette,cassette 耐酸鹼抗高溫金屬cassette,耐酸鹼抗高溫金屬,wafer baking cassette